Taconic PCB Fabrication for High-Frequency, RF, and Microwave Applications

Taconic PCB fabrication is a specialized process used to manufacture high-performance printed circuit boards (PCBs) with Taconic laminates. These laminates are engineered for low dielectric loss, stable electrical performance, and minimal moisture absorption, making them ideal for high-frequency PCB, RF PCB, microwave PCB, and high-speed PCB designs.

At Sierra Assembly Technology, we provide end-to-end Taconic PCB manufacturing services, supporting everything from prototypes to high-volume production. Our AS9100-certified, ISO 9001:2015-compliant, and IPC Class 3 facilities ensure reliable and traceable performance for mission-critical applications in defence, aerospace, telecommunications, medical, and industrial electronics.

What is Taconic PCB Fabrication?

Taconic PCB fabrication refers to the process of producing circuit boards using Taconic laminates, which are typically PTFE-based, ceramic-filled, or reinforced composites. These materials are selected for their low dielectric loss, stable dielectric constant (Dk), thermal reliability, and low moisture absorption, enabling precise signal integrity in high-frequency and high-speed PCB applications.

Key steps in Taconic PCB fabrication include:

1. Material selection: Choosing the right Taconic laminate or hybrid stack-up for the design.
2. Stack-up design: Defining the number of layers, controlled impedance traces, and signal layers.
3. Lamination: Sequentially pressing layers under heat and pressure to form a solid PCB.
4. Drilling & microvias: Creating precise access points for signal routing in HDI PCB or stacked via designs.
5. Copper patterning & etching: Forming conductive traces while maintaining controlled impedance PCB specifications.
6. Surface finishing & solder mask: Applying protective layers for assembly reliability.
7. Testing & inspection: AOI, X-ray, flying-probe, and ICT testing to validate electrical and mechanical performance.

By carefully controlling these steps, engineers achieve boards capable of supporting RF, microwave, and high-speed digital PCB systems with predictable performance.

Advantages & Disadvantages of Taconic PCB Fabrication

Advantages	Disadvantages
Superior signal integrity due to low dielectric loss and stable Dk	Higher material cost compared to standard FR-4
Excellent thermal reliability for high-power RF devices	Complex manufacturing process for HDI and hybrid stack-ups
Low moisture absorption ensures environmental stability	Soldering requires specialized processes for PTFE-based laminates
Mechanical robustness and dimensional stability	Some laminates can be brittle and require careful handling
Supports high-density HDI PCB and hybrid PCB stack-up designs	Prototype and small-volume production may have longer lead times
Enhanced EMI/EMC performance	Limited flexibility in bending or shaping the PCB
Ideal for high-frequency PCB, RF PCB, and high-speed PCB systems	Requires precision process control and advanced equipment

Taconic Materials We Work With

Material	Type	Common Applications
RF-35	Low-loss PTFE laminate	Broadband RF modules, antennas
TLY Series	Ultra-low-loss PTFE	Precision RF circuits, high-speed PCB
CER-10	Ceramic-filled laminate	Compact RF/microwave circuits
TLX Series	Reinforced PTFE	Thermal management, tight-tolerance designs
EZ-IO Series	High-speed digital	Digital backplanes, controlled impedance PCB

Hybrid PCB stack-ups combining Taconic and FR-4 are available for designers seeking cost-optimized high-frequency PCB solutions.

Taconic PCB Manufacturing Capabilities

Our Taconic PCB fabrication processes are engineered for high reliability and precision:

• Controlled impedance PCB fabrication for signal integrity
• HDI PCB and microvia integration for dense routing
• Sequential lamination for multi-layer and hybrid designs
• Heavy copper, mixed copper, and low-profile foil support
• Low-loss PTFE + FR-4 hybrid stack-ups
• Tight dielectric thickness and tolerance control

These capabilities ensure engineers can deploy high-frequency PCB, RF PCB, and high-speed PCB designs with confidence.

Quality Assurance & Testing

Area	Capability
Certifications	AS9100, ISO 9001:2015
IPC Standards	Class 3 / 3A
Compliance	ITAR registered
Inspection	Automated Optical Inspection (AOI), X-ray for buried vias
Testing	Flying-probe, In-Circuit Testing (ICT), functional validation

Rigorous QA ensures each Taconic PCB meets electrical, thermal, and mechanical specifications for high-frequency and high-speed PCB applications.

Applications for Taconic PCBs

Taconic PCB fabrication enables reliable operation in demanding systems, including:

• High-frequency RF modules
• Microwave and mmWave communication systems
• 5G/6G infrastructure and base stations
• Satellite communication hardware
• Phased-array radar and aerospace electronics
• High-speed digital backplanes and high-speed PCB networks
• Wireless instrumentation and IoT devices

Taconic PCBs provide controlled impedance PCB routing, minimal insertion loss, and high reliability in extreme environments.

Engineering Support & DFM

Early-stage collaboration ensures a successful Taconic PCB manufacturing process:

• Stack-up design for hybrid PCB stack-up efficiency
• Dielectric selection for high-frequency PCB and RF PCB designs
• Impedance verification for controlled impedance PCB performance
• HDI design support for microvia-rich boards
• Prototype-to-production scalability

Our team ensures your high-speed PCB and microwave PCB designs are ready for volume manufacturing with maximum reliability.
Design and manufacture your high-frequency PCB, RF PCB, and high-speed PCB systems with confidence. Sierra Assembly provides Taconic PCB fabrication, hybrid stack-ups, controlled impedance PCB solutions, and end-to-end support from prototype to production. Request a quote today to collaborate with a trusted U.S.-based partner experienced in HDI PCB, high-frequency PCB, RF PCB, and high-speed PCB designs.