Solder balls are formed during the soldering process, notably in reflow soldering, which includes applying solder paste to the PCB and then heating it to melt the solder and make joins by heating a metal alloy such as tin, copper, brass, or silver beyond its melting point. Once heated, the alloy is transferred to a circuit board, where it hardens to produce solder joints.
PCB corrosion refers to the breakdown of printed circuit boards (PCB) caused by various factors such as moisture, impurities, and chemical interactions. Printed circuit boards consist mainly of metal, and when exposed to oxygen, oxidation occurs when oxygen binds with metal, leading to corrosion on PCB.
In PCB design, a ground plane is a conductive layer built into the board architecture that acts as a common reference point for electrical signals and currents. Its primary function is to provide a low-impedance channel for returning currents while maintaining a steady ground potential throughout the circuit.
PCB Thermal Management is crucial for ensuring reliability and performance in electronic systems. Overheating of PCBs can lead to the degradation and failure of electronic components. Hence, it is important to effectively perform temperature control for PCBs.
PCB layering is the process of designing and manufacturing printed circuit boards that contain multiple layers of conductive material layered between insulating layers.
Design for Manufacturing also known as DFM is a set of guidelines aimed to at optimizing product designs for streamlined manufacturing. It involves a detailed analysis of factors like material selection, manufacturing techniques, and assembly processes at the design stage.
Jitter is the variation in the timing of digital signals which is often caused due to factors such as noise, interference, or timing errors within the electronic system. Jitter happens when electronic signals arrive at unexpected times, causing problems like signal disruptions and making the electronic system work less effectively.
