Reverse polarity protection is an essential safety feature in electronic circuits, required to avoid damage caused by the wrong connections of power supply terminals.
Electromagnetic interference (EMI) to circuit boards can be generated by various external sources, impacting the performance and reliability of electronic devices. PCB EMI shielding refers to the techniques and methods used to protect printed circuit boards (PCBs) from electromagnetic interference (EMI).
Properly connecting components via traces on a circuit board is essential for electronic devices' efficient & reliable operation. These traces provide the necessary electrical pathways for signals & power to flow between components, ensuring that each part receives the correct voltage & signals to function properly.
Solder balls are formed during the soldering process, notably in reflow soldering, which includes applying solder paste to the PCB and then heating it to melt the solder and make joins by heating a metal alloy such as tin, copper, brass, or silver beyond its melting point. Once heated, the alloy is transferred to a circuit board, where it hardens to produce solder joints.
PCB corrosion refers to the breakdown of printed circuit boards (PCB) caused by various factors such as moisture, impurities, and chemical interactions. Printed circuit boards consist mainly of metal, and when exposed to oxygen, oxidation occurs when oxygen binds with metal, leading to corrosion on PCB.
In PCB design, a ground plane is a conductive layer built into the board architecture that acts as a common reference point for electrical signals and currents. Its primary function is to provide a low-impedance channel for returning currents while maintaining a steady ground potential throughout the circuit.
PCB Thermal Management is crucial for ensuring reliability and performance in electronic systems. Overheating of PCBs can lead to the degradation and failure of electronic components. Hence, it is important to effectively perform temperature control for PCBs.
