Printed Circuit Board (PCB) manufacturing is a detailed and time consuming process. PCB assembly is one of the vital procedures in the entire production run. It consists of processes such as component placement, solder paste deposition, and solder printing, among others. If you want your PCB to meet all the application requirements, it is important
Choosing between IPC Class 2 vs Class 3 PCB assembly depends on your product's reliability requirements, operating environment, and intended application. Both classes follow industry-recognized acceptance criteria, but Class 3 has stricter requirements for certain assembly features.
Choose surface mount technology (SMT) for small, dense boards built in volume. Choose through-hole technology (THT) for parts that face vibration, repeated plugging, or high current. Most products use both.
A cold solder joint is a connection where the solder did not fully melt and bond to the pad and component lead. It may look acceptable and even pass a quick continuity check, then fail later under vibration, heat, or time. That is what makes it one of the more expensive PCB soldering defects.
Some areas of a printed circuit board (PCB) need temporary protection during soldering, cleaning, or coating. Peelable solder mask provides a removable barrier over these selected areas while the rest of the board goes through the required manufacturing process.
A castellated PCB is a circuit board with plated holes located directly along its edge. During PCB profiling, the board is cut through these holes, leaving exposed, plated half-holes along the edge.
PCB leakage current is unwanted electrical current that flows through an unintended path on a printed circuit board. Instead of remaining within the intended circuit path, a small amount of current can pass through the PCB surface, insulation material, contamination, or another unintended path between conductors.
