Traditional PCB manufacturing has served the electronics industry well, but as designs demand ultra-fine traces and extreme miniaturization, additive PCB manufacturing is revolutionizing how we build high-performance circuits.
In printed circuit board (PCB) assembly, where precision and repeatability are critical, thermal profiling serves as the heartbeat of the soldering process.
With the global move toward environmentally friendly electronics, lead-free PCB assembly has become the industry standard driven largely by RoHS (Restriction of Hazardous Substances) regulations.
Ensuring consistent PCB quality is vital in today’s fast-paced electronics industry—especially for prototyping and low-to-medium volume runs. At Sierra Assembly, our commitment to quality begins with reliable and accurate testing.
Printed circuit boards (PCBs) are the heart of nearly all modern electronics. But to survive in real-world environments especially harsh ones they need protection.
ENEPIG is a type of surface finish done on a copper layer to protect it from corrosion and oxidation in printed circuit boards. It is an acronym for Electroless Nickel Electroless Palladium Immersion Gold. This type of surface finish was created about a decade ago and has become more and more popular recently due to its relatively low cost when compared to other types of PCB gold plating options.
PCB cross-section analysis is a disruptive testing procedure that examines the interior microstructure of a printed circuit board (PCB). By cutting a tiny portion of the PCB, polishing it, and studying it under a microscope, layer alignment, plating thickness, solder junctions, and potential faults can all be evaluated.
Teardrops are small, tapered additions at the junction of a PCB trace and a pad or via. Instead of a sharp transition, the trace gradually widens as it meets the pad, forming a teardrop-like shape. This minor modification significantly strengthens the connection, reducing the likelihood of structural weaknesses and enhancing overall durability.
