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Specification |
Listed capability |
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Number of layers |
2–24 layers |
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Base materials |
Standard Tg 140°C FR-4; High Tg 170°C FR-4 |
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Board size |
6 × 6 mm to 457 × 610 mm |
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Board thickness |
0.6–6.5 mm |
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Copper thickness |
70, 105, 140, and 210 μm |
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Plated-hole copper |
20 μm; 25 μm also listed |
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Solder mask colors |
Green, white, blue, black, red, and yellow |
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Silkscreen colors |
White, black, and yellow |
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Surface finishes |
HASL, lead-free HASL, and ENIG |
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Build time |
24 hours to 3 weeks, subject to project review |
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