Low-Loss PCB

Low-Loss PCB Manufacturing for High-Speed Digital & RF Systems

Precision-Engineered PCB Fabrication for Superior Signal Integrity

Modern digital and RF systems demand printed circuit boards that maintain signal integrity even at elevated speeds and microwave frequencies. At Sierra Assembly, we specialize in low-loss PCB manufacturing using advanced materials engineered for exceptional dielectric stability, low insertion loss, and minimal signal attenuation delivering reliable performance where data integrity is mission-critical.
We work with a wide range of high-speed laminate systems from trusted brands such as Rogers, Taconic, Isola, and Panasonic, and can even design hybrid stack-ups to balance performance, cost, and manufacturability.

What Defines a Low-Loss PCB?

A low-loss PCB is specifically designed to minimize signal energy loss as high-frequency signals travel through the board. These boards use specialized materials and constructions that ensure consistent electrical characteristics at GHz frequencies and multi-gigabit data rates.
Key characteristics include:
• Low dielectric loss (Df): Reduces signal attenuation and power loss.
• Stable dielectric constant (Dk): Maintains consistent impedance across wide temperature and frequency ranges.
• Smooth copper foils: Minimizes skin-effect losses at microwave frequencies.
• Low conductor roughness: Enhances signal performance for high-speed digital lines.
• Low moisture absorption: Improves environmental and long-term reliability.
These properties make low-loss PCBs essential for frequencies above 1 GHz and digital speeds beyond 10–25+ Gbps.

Low-Loss Materials We Fabricate

Our facility supports an extensive material portfolio tailored for both PCB prototype and production-scale manufacturing:
• Rogers: RO4000™, RO3000™, RO4835™, RO4350B™
• Isola: I-Speed®, Astra MT77®, Tachyon 100G®
• Panasonic: Megtron 6®, Megtron 7®
• Taconic: RF, TLY, TLX, and CER® series
For applications balancing performance and cost, hybrid stack-ups combining low-loss cores with FR-4 prepregs are available for optimal design flexibility.

Advanced Manufacturing Capabilities

Our state-of-the-art manufacturing processes ensure performance consistency, precision, and dependability for every build.

Core Capabilities

• Controlled impedance within ±5% tolerance
• HDI microvias and sequential lamination
• Precision drilling for PTFE-based and hybrid materials
• Buried and blind via structures
• Mixed dielectric stack-ups
• Thin-copper and heavy-copper build options

Quality Assurance & Standards

• AS9100 and ISO 9001:2015 certified
• Built to IPC Class 3 / 3A standards
• ITAR-registered manufacturing
• Automated Optical Inspection (AOI)
• X-ray inspection for BGA and RF assemblies
• In-Circuit and Functional Testing for verified performance

Applications for Low-Loss PCBs

Low-loss PCBs enable reliable operation in high-frequency, high-bandwidth environments such as:
• High-speed data communication & networking systems
• Digital backplanes & SERDES channels
• 5G / 6G RF modules and antennas
• Automotive radar and ADAS systems
• Aerospace RF subsystems and telemetry
• High-frequency test and measurement equipment
• Industrial control and automation systems

Get Your Low-Loss PCB Quote Now

Secure signal performance that wins contracts. Request a free DFM review and quote today experience the Sierra Assembly difference trusted by California's top tech innovators.