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|
Factor |
SMT (Surface Mount) |
Through-Hole (THT) |
|---|---|---|
|
How parts attach |
Soldered to pads on the surface |
Leads soldered through drilled holes |
|
Board size and density |
Smaller; parts fit on both sides |
Larger; holes block routing |
|
Assembly method |
Automated: stencil, pick-and-place, reflow |
Wave, selective, or hand soldering |
|
Mechanical strength |
Good for small, light parts |
Better for heavy or frequently handled parts |
|
Heat and current |
Relies on copper area and thermal vias |
Handles higher power; can bolt to heatsinks |
|
High-speed signals |
Better; shorter leads, lower inductance |
Longer leads add inductance |
|
Prototype rework |
Needs rework station and steady hands |
Easy with a standard soldering iron |
|
Cost at volume |
Lower; machines place the parts |
Higher; more labor per board |
|
Component type |
Common choice |
Why |
|---|---|---|
|
Resistors, small capacitors |
SMD |
Tiny, cheap, fast to place |
|
Microcontrollers, FPGAs, memory |
SMD |
Many come only in SMD packages (QFP, QFN, BGA) |
|
Board-to-board and I/O connectors |
Through-hole or mixed |
Plugging puts repeated force on joints |
|
Large electrolytic capacitors |
Through-hole |
Height and weight need extra anchoring |
|
Transformers, relays, inductors |
Through-hole |
Weight and current need mechanical support |
|
Power transistors and regulators |
Both |
TO-220 parts bolt to heatsinks; D2PAK and DPAK use copper pours |
|
Your situation |
Likely best choice |
|---|---|
|
Wearable, IoT, or handheld product |
SMT |
|
High-volume consumer electronics |
SMT |
|
Very small enclosure |
SMT, both sides |
|
Power supply, motor controller, or industrial drive |
Mixed: SMT logic, through-hole power parts |
|
Aerospace, defense, or rugged equipment |
Mixed: through-hole connectors and heavy parts |
|
Prototype debugged by hand |
Through-hole or mixed |
|
Large connectors or frequent plug cycles |
Through-hole connectors, SMT for the rest |