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|
Feature |
PCB Laminate |
Copper Clad Laminate PCB |
|
Primary Purpose |
Insulating base material |
Base material with copper foil for circuit fabrication |
|
Copper Layer |
No |
Yes |
|
Main Function |
Mechanical support and insulation |
Creates conductive PCB layers |
|
Used For |
PCB core materials |
Single-sided, double-sided, and multilayer PCB manufacturing |
|
Material |
Key Advantage |
Typical Applications |
|
FR-4 |
Cost-effective and versatile |
Consumer and industrial electronics |
|
High-Tg FR-4 |
Better heat resistance |
Automotive and industrial systems |
|
Rogers |
Low signal loss |
RF, microwave, and 5G PCBs |
|
PTFE |
Excellent high-frequency performance |
Wireless communication and radar |
|
Polyimide |
High-temperature durability |
Aerospace and flexible PCBs |
|
Ceramic |
Excellent thermal management |
LED and power electronics |
|
Property |
Why It Matters |
|
Dielectric Constant (Dk) |
Supports signal integrity and impedance control |
|
Dissipation Factor (Df) |
Reduces signal loss in high-frequency circuits |
|
Glass Transition Temperature (Tg) |
Improves heat resistance during assembly and operation |
|
Thermal Conductivity |
Helps transfer heat away from components |
|
Coefficient of Thermal Expansion (CTE) |
Minimizes expansion and improves board reliability |
|
Feature |
Standard Lamination |
Sequential Lamination |
|
Lamination Cycles |
Single |
Multiple |
|
Via Support |
Through-hole vias |
Blind, buried, and microvias |
|
PCB Complexity |
Standard multilayer boards |
HDI and complex multilayer boards |
|
Manufacturing Cost |
Lower |
Higher |
|
Typical Applications |
Consumer and industrial electronics |