PCB Fabrication Capabilities

PCB Fabrication Capabilities

Different applications across industries demand specifically fabricated printed circuit boards. The ‘one size fits all approach’ is no longer a good idea when it comes to today’s PCB production. We, at Sierra Assembly Technology, realize this and thus have been continuously updating our capabilities and equipment to bring the boards that rightly fit your application requirements.  

Different applications across industries demand specifically fabricated printed circuit boards. The ‘one size fits all approach’ is no longer a good idea when it comes to today’s PCB production. We, at Sierra Assembly Technology, realize this and thus have been continuously updating our capabilities and equipment to bring the boards that rightly fit your application requirements. At Sierra Assembly, we acknowledge the special needs of our customers, which enable us to deliver high-quality product in the fastest turnaround times. Our factory owns the best equipment, technology, world class talent, and innovative breakthroughs that help keeping our service and product offering highly competitive. Be it rigid PCBs or Flex PCBs requirement, we own the manufacturing capabilities to better serve our customers.

Rigid PCB Fabrication Capabilities

The following are the capabilities we at Sierra Technology possess in rigid PCB fabrication.
  • Layer Count: 2 – 10 Layers
  • Max / Min Board Size
    • 1- 2Layers Max : 59" x 50" / Min: 0.2" x 0.2"
    • 4- 6Layers Max : 32" x 28" / Min: 0.4" x 0.4"
    • 8- 10Layers Max : 30" x 24" / Min0.4" x 0.4"
  • Materials: FR- 4, FR- 406, 370 HR, Rogers4003, Rogers4350, Aluminum and Copper base, Teflon
  • Surface Finishing: Lead Finishing: HASL, HASL+Gold finger, Lead- free Finishing: Lead- free HASL, ENG Gold; OSP, Immersion silver, Plated Ni/Au, Immersion Tin
  • Silk Screen Color: White, Black
  • Copper Thickness: 9 µm, 12 µm, 18 µm, and 35 µm
  • Min. Line / Spacing: 125 µm / 125 µm
  • Smallest Drill: 0.28 mm
  • Stiffener Material: FR4, Steel, Aluminum
  • Min. Annular Ring: 150 µm
  • Min. Soldermask Dam: 100 µm
  • Drill to copper: Outer layers 8 mil
  • Drill to copper: Inner layers 10 mil
  • Minimum Pitch: 0.5 mm
  • Copper Thickness: 0.5 oz. - 4 oz.
  • Copper to Board Edge : 0.007?
  • Minimum Hole Size: 0.004?
  • Coverlay Opening: 0.003?
  • Testing and Inspection capabilities: X-ray Testing, Visual Inspection, Functional Testing, Automated Optical Inspection (AOI), In-Circuit Testing (ICT)
  • Lead Times: 1 - 5 Days, 1 - 2 Weeks and Scheduled Deliveries

Flex PCB Fabrication Capabilities

The following are the capabilities we own when it comes to the fabrication of flex PCBs.
  • Layers: Multilayers up to 20 layers
  • Minimum Annular Ring: 4Mil
  • Copper Weight: 0.5-2.0 Oz
  • Minimum Hole Diameter: 8 Mil
  • Materials: PI, PET, PEN, FR-4, Polyimide (Kapton), Adhesiveless Copper Clad Base Material, High Performance Epoxy Laminate and Prepreg, and High Performance Polyimide Laminate and Prepreg.
  • Stencils: Laser cut stainless steel and Nano-coating
  • Surface Treatments: Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin
  • Max / Min Board Size: 0.2"x0.3" Max: 20.5"x13"
  • Copper Thickness: 1/3oz - 2oz
  • Max / Min Insulation Thickness: 2mil/0.5mil (50um/12.7um)
  • Lead Time: 1 - 5 Days, 1 - 2 Weeks and Scheduled Deliveries

Rigid Flex PCB Fabrication Capabilities

The following rigid flex PCB fabrication capabilities have helped us conceptualize and materialize complex designs easily.
  • Layers: Multilayers = 20 (rigid area)
  • Materials: FR4 HTg, Polyimide
  • Maximum Board Size: 720 X 600 mm
  • Max board thickness : 5 mm max
  • Min. Core Thickness: .002 in
  • Copper thickness : 9µ, 17.5µ, 35µ, 70µ, 105µ
  • Dielectric thickness/rigid : 80µ min
  • Drill to copper – Outer layers: 8 mil
  • Drill to copper – Inner layers: 10 mil
  • Copper Thickness: 0.5 Oz - 4 Oz
  • Minimum Hole Size: 0.004"
  • Minimum Trace/Space: 0.003"/0.003"
  • Minimum Pitch: 0.5 mm
  • Process Pad Diameter: D + .014 in. (1 mil annular ring)
  • Controlled Impedance Tolerance: 10%
  • Bow and Twist Tolerance: 7% along rigid area
  • Thickness Tolerance: 10%
  • Heat Sink: Internal (Copper thickness 0.15 to 0.8mm), external (Aluminum Copper)
  • Routing Tolerance: +/-100µ with mechanical routing/ +/- 50µ with laser routing (maximum thickness 5/10 mm)
  • Surface Finishes: HASL (Vertical or Horizontal), Lead-Free HASL, OSP, ENIG, Immersion Silver, Immersion White Tin, Tin Nickel, Electrolytic Hard and Soft Au, Selective Au
  • Cavities: Through or blind

Our ITAR Certified, IPC-WHMA-A-620, ISO 13485, ISO 9001:2015+ AS9100D, IPC-CC-830B Compliant, SBA certified, rigid and flex circuits boards meet the needs of a wide range of industries. With the capabilities aforementioned, the boards can be customized to meet the requirements of the medical, industrial control, aerospace and defense, telecommunications, electronics industries among others.

If you would like to know more of the technical capabilities we own in rigid and flex PCB making, get in touch with an expert at Sierra Assembly Technology. Get all your queries cleared and write in the board information into our quote forms.


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