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High Density Interconnect (HDI) are integral elements of advanced electronics. They are referred by a variety of names, such as Microvia Process (MVP), Sequence Build Up (SBU), and Build Up Multilayer Boards (BUM). These PCBs are loaded with technical characteristics, which make them ideal for today’s devices demanding excellent performance, and lightweight designs. This post attempts to answer all questions that you may have regarding HDI PCBs.
High Density Interconnect (HDI) PCBs receive their name from high density routing connections, which hold a large number of components. These high density routing connections have helped reduce the footprint of various popular electronic devices such as tablets, smartphones, computers, and wearable technology products like Virtual Reality (VR devices), and fitness bands.
HDI PCBs offer several technical advantages over Surface Mounted (SMT) and through-hole boards.
As with any other PCB technology, HDI PCB demands some specific concerns such as:
Design complexity, demand for accuracy, and increasing relevance of compact sized PCBs are some of the factors, which have shifted spotlight on HDI PCB planning, layout and manufacturing. These reasons are also forcing PCB designers and OEMs to outsource their manufacturing to experts. Sierra Assembly Technology, Inc. is a leading manufacturer of HDI PCBs in the US. The PCBs are used in various industrial applications.
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